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Etude du comportement du polyphénylquinoxaline (PPQ) et de ses interfaces lors de l'assemblage d'un réseau d'interconnexioins multiniveaux Cu/PPQ pour circuits hybrides à très haute intégration = Study of behaviour of polyphenylquinoxaline (PPQ) and its interfaces during the technological steps in the fabrication of Cu/PPQ multilayered interconnection structures for multichip modulesTemplier, François; Madar, Roland.1992, 147 p.Thesis

Sintering and reorganization of electrochemically etched mesoporous germanium layers in various atmospheresGARRALAGA ROJAS, E; HENSEN, J; BAUR, C et al.Solar energy materials and solar cells. 2011, Vol 95, Num 1, pp 292-295, issn 0927-0248, 4 p.Conference Paper

Patterning of Bi₂Sr₂CaCu₂O_8+x and SrTiO₃ films using lift- off technique combined with MODKAWATA, T; IWASAKI, H; YUFUNE, S et al.Physica. C. Superconductivity. 2006, Vol 445-48, pp 873-875, issn 0921-4534, 3 p.Conference Paper

Micropatterning and transferring of polymeric semiconductor thin films by hot lift-off and polymer bonding lithography in fabrication of organic field effect transistors (OFETs) on flexible substrateXINHONG YU; ZHE WANG; SUNYANG YU et al.Applied surface science. 2011, Vol 257, Num 22, pp 9264-9268, issn 0169-4332, 5 p.Article

Bead-based single protein micro-array realized through electrostatic self-assembly of carboxylated beadsSIVAGNANAM, Venkataragavalu; SAYAH, Abdeljalil; GIJS, Martin A. M et al.Microelectronic engineering. 2008, Vol 85, Num 5-6, pp 1355-1358, issn 0167-9317, 4 p.Conference Paper

On the lift-off speed in journal bearingsXIAOBIN LU; KHONSARI, Michael M.Tribology & lubrication technology. 2006, Vol 62, Num 3, pp 40-46, issn 1545-858X, 7 p.Article

Structure size dependent recovery of thin polystyrene layers in thermal imprint lithographyBOGDANSKI, Nicolas; WISSEN, Matthias; MÖLLENBECK, Saskia et al.Microelectronic engineering. 2007, Vol 84, Num 5-8, pp 860-863, issn 0167-9317, 4 p.Conference Paper

A lift-off process for high resolution patterns using PMMA/LOR resist stackYIFANG CHEN; KAIWU PENG; ZHENG CUI et al.Microelectronic engineering. 2004, Vol 73-74, pp 278-281, issn 0167-9317, 4 p.Conference Paper

Fabrication of terahertz metamaterials using S1813/LOR stack by lift-offXIAOXIANG XIA; HAIFANG YANG; YIMIN SUN et al.Microelectronic engineering. 2008, Vol 85, Num 5-6, pp 1433-1436, issn 0167-9317, 4 p.Conference Paper

Large area arrays of metal nanowiresAUZELYTE, V; SOLAK, H. H; EKINCI, Y et al.Microelectronic engineering. 2008, Vol 85, Num 5-6, pp 1131-1134, issn 0167-9317, 4 p.Conference Paper

Replication of sub-40 nm gap nanoelectrodes over an 8-in. substrate by nanoimprint lithographyTALLAL, J; PEYRADE, D; LAZZARINO, F et al.Microelectronic engineering. 2005, Vol 78-79, pp 676-681, issn 0167-9317, 6 p.Conference Paper

Uniform growth and repeatable fabrication of inch-sized wafers of a single-crystal diamondYAMADA, Hideaki; CHAYAHARA, Akiyoshi; MOKUNO, Yoshiaki et al.Diamond and related materials. 2013, Vol 33, pp 27-31, issn 0925-9635, 5 p.Article

Nanoimprint lithography resist profile inversion for lift-off applicationsSHIELDS, Philip A; ALLSOPP, Duncan W. E.Microelectronic engineering. 2011, Vol 88, Num 9, pp 3011-3014, issn 0167-9317, 4 p.Article

Improvements of crystallinity of single crystal diamond plates produced by lift-off process using ion implantationMOKUNO, Y; CHAYAHARA, A; YAMADA, H et al.Diamond and related materials. 2010, Vol 19, Num 2-3, pp 128-130, issn 0925-9635, 3 p.Conference Paper

Experimental characterization of diesel ignition and lift-off length using a single-hole ECN injectorBENAJES, Jesús; PAYRI, Raúl; BARDI, Michele et al.Applied thermal engineering. 2013, Vol 58, Num 1-2, pp 554-563, issn 1359-4311, 10 p.Article

Nanostructure fabrication using lithium fluoride films as an electron beam resistLANGHEINRICH, W; SPANGENBERG, B; BENEKING, H et al.Journal of vacuum science & technology. B. Microelectronics and nanometer structures. Processing, measurement and phenomena. 1992, Vol 10, Num 6, pp 2868-2872, issn 1071-1023Conference Paper

Directed self-assembly of block copolymers for next generation nanolithographyJEONG, Seong-Jun; JU YOUNG KIM; BONG HOON KIM et al.Materials today (Kidlington). 2013, Vol 16, Num 12, pp 468-476, issn 1369-7021, 9 p.Article

Mechanism and prevention of lift-off in lead-free solderingSUGANUMA, Katsuaki.SPIE proceedings series. 2000, pp 303-307, isbn 0-930815-62-9Conference Paper

Nanoimprint and micro-contact printing tri-layer processesCHEN, Y; LEBIB, A; LI, S et al.EPJ. Applied physics (Print). 2000, Vol 12, Num 3, pp 223-229, issn 1286-0042Article

Impact of optical properties of front glass substrates on Cu(In,Ga)Se₂ solar cells using lift-off processTAMURA, Akihiro; ABE, Yasuhiro; MINEMOTO, Takashi et al.Thin solid films. 2013, Vol 546, pp 379-382, issn 0040-6090, 4 p.Conference Paper

Electron beam lithography of HSQ/PMMA bilayer resists for negative tone lift-off processHAIFANG YANG; AIZI JIN; QIANG LUO et al.Microelectronic engineering. 2008, Vol 85, Num 5-6, pp 814-817, issn 0167-9317, 4 p.Conference Paper

Fabrication of metallic structures with lateral dimensions less than 15 nm and j_C(T)-measurements in NbN micro-and nanobridgesBARTOLF, H; ENGEL, A; SCHILLING, A et al.Physica. C. Superconductivity. 2008, Vol 468, Num 7-10, pp 793-796, issn 0921-4534, 4 p.Conference Paper

Controlled arrangement of nanoparticles capped with protecting ligand on Au nanopatternsYAMAMOTO, Hiroki; OHNUMA, Akira; OHTANI, Bunsho et al.Microelectronic engineering. 2014, Vol 121, pp 108-112, issn 0167-9317, 5 p.Article

Measurement of charge carrier's transportation in a large size self-standing CVD single crystal diamond film fabricated using lift-off methodFUJITA, F; KAKIMOTO, A; FURUSAKA, M et al.Diamond and related materials. 2010, Vol 19, Num 2-3, pp 162-165, issn 0925-9635, 4 p.Conference Paper